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Multi Layer board
Introduction 
Product functionality depends on the interconnection between the layers that it is made up of. Without microvia production improvements, manufacturers are forced to increase product size to improve performance. The increasing cost of property is driving all industries to seek smaller products, lowering the demand for end products that contain thick, high-layer count printed circuit boards.
Main Application
Telecom、Computer Peripheral、Aero、Automotive Industry
Specification
| Capability |
UNIT |
STANDARD |
SPECIAL |
| Layer Count |
Layers |
2-4-6-8 |
Max. 32 |
| Total Thickness (Min/Max) |
mm |
0.8/4.2 |
0.5/5.0 |
| Min. Line/Space |
μm |
150/150 |
100/100 |
| Min. Via/Land |
μm |
300/600 |
250/500 |
| Base Material |
|
CEM3, FR-4, FR-5(High-Tg), H-Free |
| Surface Treatment |
|
HSAL/OSP/Immersion Gold |
Tin/Silver |
Layer Structure
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